①Ultra-thin: Min. thickness to 0.4mm;
②Excellent performance including high energy density ,long life cycles , can package under 100℃ for 30s and good discharge performance under -20~0℃ low temperature;
③Can use ACF conductive adhesive packaging or soldering process;
④Customized according to different environmental fields and size.
Application field: Used in Smart card , Active RFID,Temperature stickers, Anti-lost label, Tracking card etc.